Pain points： Alternative without standards, difficulty in controlling transformation risks

After the prohibition of intellectual property transfer in Nexperia, enterprises are caught in” Alternative without direction”. A certain intelligent device enterprise blindly replaces the Nexperia ESD device, causing EMC test failure and project delay. Lack of full process guidance for substitution: sample testing and mass production control need to be handled independently. Nexperia technical support interruption, lack of adaptation suggestions, and numerous companies have reported high testing and time costs, as well as prominent transformation risks.

Transformation： Leiditech “Three stages” Implementation of an alternative security system
Shanghai Leiditech has established a "Test stage - Alternative stage- Mass production stage" system： During the testing phase, multiple indicators are compared (such as VRWM, VBR, IPP, etc.) to quickly issue reports; During the Alternative stage, a “one-on-one” technical connection was provided. A certain automotive electronics enterprise received PCB layout guidance, effectively avoiding signal interference. During the mass production stage, fully automated inspection is implemented, and each batch passes high and low temperature as well as pulse reliability tests. Offer free compatibility analysis, significantly reducing the trial-and-error costs for enterprises.

Gain： Zero risk transformation and long-term technological support
A certain smart home enterprise successfully transitioned from testing to mass production in a relatively short period, achieving a smooth production process and a significant reduction in testing costs. After batch application, the defect rate of the products is extremely low, comparable to Nexperia devices. Leiditech has been continuously investing in research and development, and has made early preparations for the latest low-capacitance ESD alternative models of Nexperia. With its technical support, a certain consumer electronics enterprise has taken the lead in launching USB4.0-compatible products, seizing the market opportunity first.